DESCRIPTION
xWafers used for anodic bonding or as carriers in wafer thinning processes require thermal expansion behavior that matches the silicon wafer to be bonded. BOROFLOAT® wafers provide matched thermal expansion, flatness, process robustness, and high UV transmission.
Wafer Options
We produce Schott® BOROFLOAT® 33 wafers to SEMI Standards including dimensional, flat, and notch specifications. We offer custom specifications including alignment marks, holes, pockets, edge profile, thickness, flatness, surface quality, and cleanliness.
Electrical Properties
Electrical Properties
| Property | Value |
|---|---|
| Dielectric Strength (25°C, 50Hz) | 16 kV/mm |
| Dielectric Constant (25°C, 1MHz) | 4.6 |
| Loss Tangent (25°C, 1MHz) | 37 x 10⁻⁴ |
| Electric Volume Resistivity (250°C) | 8.0 |
| Electric Volume Resistivity (350°C) | 6.5 |
Thermal Properties
| Property | Value |
|---|---|
| Thermal Coefficient of Expansion (20-300°C) | 3.25 x 10⁻⁶ K⁻¹ |
| Specific Thermal Capacity (20-100°C) | 0.83 KJ x (kg x K)⁻¹ |
| Specific Thermal Conductivity (90°C) | 1.2 W x (m x K)⁻¹ |
| Annealing Point | 560°C / 1040°F |
| Softening Point | 815°C / 1508°F |
| Thermal Conductivity @90°C | 1.2 W/mk |
Mechanical Properties
| Property | Value |
|---|---|
| Density (25°C / 77°F) | 2.23 g/cm³ |
| Modulus of Elasticity | 63 kN/mm² |
| Young's Modulus (25°C / 77°F) | 64 kN/mm² |
| Knoop Hardness HK | 0.1/20: 480 |
| Poisson's Ratio | 0.2 |
| Bending Strength | 25 MPa |
Maximum Operating Temperature (RTG and RTS)
| Condition | Value |
|---|---|
| Short Term | 500°C / 932°F |
| Long Term | 450°C / 842°F |
Optical Properties
| Property | Value |
|---|---|
| Refractive Index | 1.471 |
| Index of Refraction @435.8nm | 1.48 |
| Index of Refraction @589.3nm | 1.47 |
| Index of Refraction @656.3nm | 1.46 |
| Dispersion | 71.4 x 10⁻⁴ |
| Abbe Constant | 65.41 |
TECHNICAL DETAILS
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Glass Wafer
Our Wafer Glass Collection includes a carefully selected range of high-performance glass wafers designed for semiconductor processing, microfabrication, optical systems, and scientific research. This collection covers multiple material types to meet different thermal, optical, and mechanical requirements across advanced applications.
Available Glass Wafer Materials
The available materials include JGS2 quartz glass wafers, fused silica glass wafers, Eagle XG® glass wafers, and BOROFLOAT® 33 borosilicate glass wafers. Each material offers distinct advantages in terms of thermal stability, optical transmission, surface flatness, and chemical resistance, enabling reliable performance in demanding environments.
These materials are widely used as glass wafer substrates in semiconductor and photonics applications where dimensional stability and optical performance are critical.
Typical Applications of Wafer Glass
Glass wafers from this collection are commonly used in a variety of advanced technologies, including:
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MEMS devices
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Microfluidic chips
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Photolithography processes
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Sensors and detector platforms
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Optical coatings and thin film deposition
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Wafer bonding processes
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Laboratory and university research
Their compatibility with standard wafer processing equipment makes them ideal for both research prototyping and production environments.
Standard Sizes and Custom Processing
Standard wafer sizes and thicknesses are available for rapid deployment in semiconductor and laboratory workflows. In addition to standard products, we also support custom glass wafer processing, including:
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Precision wafer cutting
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Double-side polishing
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Custom thickness fabrication
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Edge grinding and finishing
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Special processing for optical or microfabrication applications
These capabilities allow engineers and researchers to obtain wafer substrates tailored to their specific experimental or production requirements.
Engineering Support and Custom Requests
This collection is intended for engineers, researchers, and manufacturers seeking stable, high-quality glass wafer substrates for prototyping, pilot production, and volume manufacturing.
For custom requirements or technical consultation, please feel free to contact our team.
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