Fused silica wafer precision polished surface
Fused silica glass wafer
HPFS 7980 quartz wafers

Fused Silica Glass Wafers

$58.82
$58.82

Type: Fused Silica Glass Wafers

  • BOROFLOAT® 33 Glass Wafer | 2" 4" 6" 8"
  • Eagle XG® Glass Wafers
  • Fused Silica Glass Wafers
  • JGS1 Quartz Wafer
  • Sapphire Wafer

If the selected size does not have the thickness you need, please contact us.
Custom Size

Subtotal: $58.82

DESCRIPTION

DESCRIPTION
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HPFS® Standard Grade 7980, is a high purity synthetic amorphous silicon dioxide manufactured by flame hydrolysis. The noncrystalline, colorless, silica glass combines a very low thermal expansion coefficient with excellent optical qualities and exceptional transmittance in ultraviolet. It is available various grades for different applications.

Wafer Options

Coresix produces HPFS® Standard Grade Wafers to all SEMI Standards including dimensional, flat and notch specifications. Additionally, we offer custom specifications designed to your unique needs including, alignment marks, holes, pockets, edge profile, thickness, flatness, surface quality, cleanliness or other details critical to your application.

Electrical Properties

Property Condition Value
Log10 Volume Resistivity (250°C, 482°F) 11.8 ohm·cm

Thermal Properties

Property Value
Softening Point* 1585 °C
Annealing Point* 1042 °C
Strain Point* 893 °C
Specific Heat 0.770 J/(g·K)
Thermal Conductivity 1.38 W/mk
Thermal Diffusivity 0.0075 cm²/s

Thermal Expansion ** (ppm/C)

Temperature Range Value
5°C to 35°C 50.52 x 10⁻⁶
0°C to 200°C 0.57 x 10⁻⁶
-100°C to +200°C 0.48 x 10⁻⁶

Mechanical Properties

Property Value
Density (25°C) 2.20 g/cm³
Elastic (Young's) Modulus 73 GPa
Shear Modulus (25°C) 31 GPa
Modulus of Rupture, abraded 52.4 MPa
Bulk Modulus 35.9 GPa
Knoop Hardness (100g load) 522 kg/mm²
Poisson's Ratio 0.16
Tensile Strength 54 MPa
Compressive Strength 1.14 GPa

Optical Properties

Property Value
Abbe Constraints Vₑ 67.6
Abbe Constraints Vd 67.8
Stress Coefficient 35.0 nm/cm MPa

Refractive Index (Conditions: 22°C, 760 mm Hg, N₂)

Wavelength Refractive Index 2n Thermal Coefficient Δn/ΔT3 [ppm/C]
@435.957nₘ 1.466691 10.6
@587.725nₘ 1.458461 10.1
@656.454nₘ 1.456364 9.9

TECHNICAL DETAILS

TECHNICAL DETAILS
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Material:
HPFS® Fused Silica, Standard Grade 7980
Purity:
SiO₂ ≥99.99%
Transmission Range:
UV to Infrared
Thermal Expansion:
~0.58 × 10⁻⁶ /°C
Surface Finish:
Optical Grade, Precision Polished
Typical Applications:
Semiconductor Lithography, UV Optics, Precision Optical Assembly
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Fused Silica Glass Wafers

Fused Silica Glass Wafers

$58.82
Fused Silica Glass Wafers
Fused silica wafer precision polished surface
Fused silica glass wafer
HPFS 7980 quartz wafers

Fused Silica Glass Wafers

$58.82
尺寸: 4″ (100mm)

Glass Wafer

Our Wafer Glass Collection includes a carefully selected range of high-performance glass wafers designed for semiconductor processing, microfabrication, optical systems, and scientific research. This collection covers multiple material types to meet different thermal, optical, and mechanical requirements across advanced applications.

glass wafer substrates

Available Glass Wafer Materials

The available materials include JGS2 quartz glass wafers, fused silica glass wafers, Eagle XG® glass wafers, and BOROFLOAT® 33 borosilicate glass wafers. Each material offers distinct advantages in terms of thermal stability, optical transmission, surface flatness, and chemical resistance, enabling reliable performance in demanding environments.

These materials are widely used as glass wafer substrates in semiconductor and photonics applications where dimensional stability and optical performance are critical.

Typical Applications of Wafer Glass

Glass wafers from this collection are commonly used in a variety of advanced technologies, including:

  • MEMS devices

  • Microfluidic chips

  • Photolithography processes

  • Sensors and detector platforms

  • Optical coatings and thin film deposition

  • Wafer bonding processes

  • Laboratory and university research

Their compatibility with standard wafer processing equipment makes them ideal for both research prototyping and production environments.

Standard Sizes and Custom Processing

Standard wafer sizes and thicknesses are available for rapid deployment in semiconductor and laboratory workflows. In addition to standard products, we also support custom glass wafer processing, including:

  • Precision wafer cutting

  • Double-side polishing

  • Custom thickness fabrication

  • Edge grinding and finishing

  • Special processing for optical or microfabrication applications

These capabilities allow engineers and researchers to obtain wafer substrates tailored to their specific experimental or production requirements.

Engineering Support and Custom Requests

This collection is intended for engineers, researchers, and manufacturers seeking stable, high-quality glass wafer substrates for prototyping, pilot production, and volume manufacturing.

For custom requirements or technical consultation, please feel free to contact our team.

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