Eagle XG wafer marking
Eagle XG borosilicate glass wafer surface detail

Eagle XG® Glass Wafers

$58.82
$58.82

Type: Eagle XG® Glass Wafers

  • Fused Silica Glass Wafers
  • BOROFLOAT® 33 Glass Wafer | 2" 4" 6" 8"
  • Eagle XG® Glass Wafers
  • JGS1 Quartz Wafer
  • Sapphire Wafer

If the selected size does not have the thickness you need, please contact us.
Custom Size

Subtotal: $58.82

DESCRIPTION

DESCRIPTION
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Corning® EAGLE XG® delivers dimensional stability and exceptionally clean, smooth, flat surfaces. The Alkaline earth boro-alum nosilicate composition includes no added heavy metals reducing the environmental impact of manufacturing. It also features exceptional thinness, helping to completely avoid the potential environmental and health hazards associated with pane thinning.

Wafer Options

Coresix produces Eagle XG® wafers to all SEMI Standards including dimensional, flat and notch specifications. In addition, we offer custom specifications designed to your unique needs including alignment marks, holes, pockets edge profile, thickness flatness surface quality, cleanliness or any other details critical to your application.

Electrical Properties

Property Value
Log₁₀ Volume Resistivity at 250°C - 12.9 ohm-cm
Log₁₀ Volume Resistivity at 500°C - 8.8 ohm-cm
Dielectric Constant (20°C, 1kHz) 6.17
Loss Tangent (20°C, 1kHz) 0.15%

Thermal Properties

Property Value
Thermal Expansion (0-300°C) 31.7 x 10⁻⁷ /°C
Thermal Expansion Room Temp 35.5 x 10⁻⁷ /°C
To Settling Point (25 - 675°C)

Thermal Conductivity

Temp (°C) Specific Heat (J/g·K) Thermal Diffusivity (cm²/sec) Thermal Conductivity (W/cm·K)
23 0.768 0.00601 0.0109
100 0.896 0.00572 0.0122
200 0.998 0.00546 0.0129
300 1.067 0.00530 0.0134
400 1.110 0.00522 0.0137
500 1.154 0.00518 0.0142

Mechanical Properties

Property Value
Density (20°C) 2.38 g/cc
Young's Modulus 73.6 GPa
Shear Modulus 30.1 GPa
Poisson's Ratio 0.23
Vickers Hardness (200gm load, 25 sec dwell) 640

Optical Properties

Optical Wavelength Refractive Index
435.8 nm 1.5198
467.8 nm 1.5169
480 nm 1.5160
508.6 nm 1.5141
546.1 nm 1.5119
589.3 nm 1.5099
643.8 nm 1.5078
eagle xg Optical Transmission

TECHNICAL DETAILS

TECHNICAL DETAILS
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Material:
Corning Eagle XG® Glass
Thermal Expansion:
3.17 × 10⁻⁶ /°C
Density:
2.37 g/cm³
Strain Point:
669 °C
Surface Finish:
Precision Polished, Low Roughness
Typical Applications:
Flat Panel Displays, OLED, Semiconductor Processing, MEMS
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Eagle XG® Glass Wafers

Eagle XG® Glass Wafers

$58.82
Eagle XG® Glass Wafers
Eagle XG wafer marking
Eagle XG borosilicate glass wafer surface detail

Eagle XG® Glass Wafers

$58.82
尺寸: 4″ (100mm)

Glass Wafer

Our Wafer Glass Collection includes a carefully selected range of high-performance glass wafers designed for semiconductor processing, microfabrication, optical systems, and scientific research. This collection covers multiple material types to meet different thermal, optical, and mechanical requirements across advanced applications.

glass wafer substrates

Available Glass Wafer Materials

The available materials include JGS2 quartz glass wafers, fused silica glass wafers, Eagle XG® glass wafers, and BOROFLOAT® 33 borosilicate glass wafers. Each material offers distinct advantages in terms of thermal stability, optical transmission, surface flatness, and chemical resistance, enabling reliable performance in demanding environments.

These materials are widely used as glass wafer substrates in semiconductor and photonics applications where dimensional stability and optical performance are critical.

Typical Applications of Wafer Glass

Glass wafers from this collection are commonly used in a variety of advanced technologies, including:

  • MEMS devices

  • Microfluidic chips

  • Photolithography processes

  • Sensors and detector platforms

  • Optical coatings and thin film deposition

  • Wafer bonding processes

  • Laboratory and university research

Their compatibility with standard wafer processing equipment makes them ideal for both research prototyping and production environments.

Standard Sizes and Custom Processing

Standard wafer sizes and thicknesses are available for rapid deployment in semiconductor and laboratory workflows. In addition to standard products, we also support custom glass wafer processing, including:

  • Precision wafer cutting

  • Double-side polishing

  • Custom thickness fabrication

  • Edge grinding and finishing

  • Special processing for optical or microfabrication applications

These capabilities allow engineers and researchers to obtain wafer substrates tailored to their specific experimental or production requirements.

Engineering Support and Custom Requests

This collection is intended for engineers, researchers, and manufacturers seeking stable, high-quality glass wafer substrates for prototyping, pilot production, and volume manufacturing.

For custom requirements or technical consultation, please feel free to contact our team.

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